ADLINK: hands-on demonstration of OpenRack, OpenSled infrastructure at Broadband World Forum

The telecom industry will get its first view of the Open Compute Project (OCP) carrier grade CG-OpenRack-19 specification featuring ADLINK’s OCP-ACCEPTED OpenSled configuration using the latest Intel Xeon Scalable Processors with Intel C620 Series Chipsets. The CG-OpenRack-19 specification is the result of OCP’s Telecom Working Group, which develops open architecture for carrier grade, frame-level solutions. The open architecture for CG-OpenRack-19 based on the Radisys contributed OCP-ACCEPTED OpenRack specification and ADLINK’s OCP-ACCEPTED OpenSled specification will be on display in the OCP Experience Zone at the international Broadband World Forum.

The OCP-ACCEPTED OpenRack, OpenSled configuration marks a significant milestone in the evolution of OCP CG-OpenRack-19 as it continues the expansion of OCP-CG open architectures. The specification offers telecom data center operators the benefits of open platform standards combined with the needed carrier-grade and environmental enhancements required for Edge Computing in telecom data center environments. The open system approach drives innovation in the market and allows operators to avoid vendor lock-in that comes with propriety solutions.

ADLINK and Radisys are active members in OCP and have been instrumental in defining a technology path to an open architecture solution for the telecom industry. Radisys laid the foundation for the OCP-ACCEPTED CG-OpenRack-19 spec by submitting definitions for the frame, power, interconnect and sled dimensions. Its DCEngine is the industry’s first open hardware solution based on the specification.

The OCP-ACCEPTED OpenSled spec, based on ADLINK’s OCCERA (Open Compute Carrier-grade Edge Reference Architecture), enhances the original spec by providing definitions for the internal configuration options of the CG-OpenRack-19 sled, including options for key appliances to utilize additional components inside the sled.

The ADLINK sled displayed with the OCP CG-OpenRack-19 implementation at the Broadband World Forum will feature the latest Intel Xeon Scalable Processors with Intel C620 Series Chipsets. The platform provides compelling benefits across a broad variety of use models, including big data, artificial intelligence, high-performance computing, enterprise-class IT, cloud, storage, communication and Internet of Things. Feature enhancements over previous versions of Intel Xeon Processor-based platforms include 1.5x memory bandwidth, integrated network/fabric and optional integrated accelerators.

More Information...

Latest News from ADLINK Technology

ADLINK: two new CompactPCI 2.0 processor blades with latest Intel Xeon, Core and Atom
ADLINK: “quad” core i3 value processor on COM Express
ADLINK to exhibit at Edge Computing Congress 2018
ADLINK: COTS solutions for train control, rail signaling and automation at InnoTrans 2018
ADLINK honoured Edge Computing Company of the Year
ADLINK joins Open Networking Foundation as collaborating innovator
ADLINK: smart gateway selected for Michelin-SoftBank tire control system
ADLINK partners with FFG for 5G- and ROS2-based factories of the future
ADLINK: fanless Embedded computers with Windows 7 support
ADLINK demonstrates Fog Computing at embedded world
ADLINK brings ‘AI at the Edge’ with NVIDIA technology
ADLINK supports SGeT’s UIC with XRCE middleware for device-fog-cloud computing
ADLINK and MECSware to demonstrate Private LTE at Mobile World Congress
ADLINK at Embedded World 2018
ADLINK: insights on how to transform current factories into factories of the future
ADLINK: IIoT-ready rugged, compact IoT gateway/controller
ADLINK: hands-on demonstration of OpenRack, OpenSled infrastructure at Broadband World Forum
ADLINK: PCI/104-Express SBC provides three digital display interface channels

Perfect Motion Control For the Networked World

We live in a physical world where everything is connected. Trinamic transforms digital information into physical motion with accessible, flexible, and easy to use toolkits putting the world’s be...


New High-Performance Serial NAND: A Better High-Density Storage Option for Automotive Display

The automotive requirements: speed, reliability and compatibility. Winbond's high-performance serial NAND Flash technology offers both cost and performance advantages over the SPI NOR Flash typica...


President Tung-Yi talks about Winbond

Winbond is a leading specialty memory solution provider with a wide rage of product portfolio. Owned technology and innovation are our assets for our industry and our customers. Winbond we are high qu...


New Memory and Security Technologies for Designers of IoT Devices

Internet of Things (IoT) edge nodes are battery-powered, often portable, and are connected to an internet gateway or access point wirelessly. This means that the most important constraints on new I...


Winbond TrustMe Secure Flash - A Robust and Certifiable Secure Storage Solution

Winbond has introduced the TrustMe secure flash products to address the challenge of combining security with advanced process nodes and remove the barriers for adding secure non-volatile storage to pr...


Ultra-Low-Power DRAM: A “Green” Memory in IoT Devices

Winbond is offering a new way to extend the power savings available from Partial Array Self-Refresh (PASR), which was already specified in the JEDEC standard by implementing a new Deep Self-Refresh (D...


Polytronics Thermal Conductive Board (TCB) at Electronica 2018

This video introduce the basic product structure, advantage, and application of Polytronics thermal conductive board (TCB). Polytronics exhibit wide range of circuit protection products and thermal ma...


Arrow and Analog Devices strategic partnership and collaborative approach to provide solutions for our customers.

Mike Britchfield (VP for EMEA Sales) talks about why Analog Devices have a collaborative approach with Arrow Arrow’s design resources are key, from regional FAEs in the field to online des...


WE MAKE IT YOURS! Garz & Fricke to present the latest HMIs and SBCs at Electronica 2018

Sascha Ulrich, Head of Sales at Garz & Fricke, gives you a quick overview about the latest SBC, HMI and Panel-PC Highlights at electronica 2018. Learn more about the SANTOKA 15.6 Outdoor HMI, the ...


Macronix Innovations at electronica 2018

Macronix exhibited at electronica 2018 to showcase its latest innovations: 3D NAND, ArmorFlash secure memory, Ultra Low Vcc memory, and the NVM solutions with supreme quality mainly focusing on Automo...


ams CEO talks about their sensor solutions that define the mega trends of the future

In this video Alexander Everke, ams’ CEO, talks to Alix Paultre of EETimes about their optical, imaging and audio sensor solutions in fast-growing markets – from smartphones, mobile device...


Intel accelerated IoT Solutions by Arrow

Arrow is showing Intel’s Market Ready Solutions in a Retailer shop with complete eco environment. From sensors via gateways into the cloud, combined with data analytics, the full range of Intel ...


CSTAR - Manufacturers of cable assembly from Taiwan

CSTAR was founded in 2010 in Taipei, Taiwan. Through years of experience, we are experts in automotive products, LCD displays, LCD TVs, POS, computers, projectors, laptops, digital cameras, medical ca...


NXP Announces LPC5500 MCU Series

Check this video to discover the new NXP microcontroller LPC5500, the target application and focus area. Links to more information: LPC5500 Series: World’s First Arm® Cortex® -M...


Molex Meets Solutions at Electronica

These are exciting times in the electronics world as Molex migrates from a pure connectors company to an innovate solutions provider. Solutions often start at the component level, such as the connecto...


Alix Paultre investigates Bulgin's new optical fiber rugged connector range at Electronica 2018

Alix Paultre interviews Bulgin's Engineering Team Leader Christian Taylor to find out more about the company's new range of optical fiber connectors for harsh environments. As the smallest rug...


Cypress MCU and Connectivity are the best choice for real-world IoT solutions.

Cypress’ VP of Applications, Alan Hawse, explains why people should use Cypress for their IoT connectivity and MCU needs. Cypress wireless connectivity and MCU solutions work robustly and sea...


Chant Sincere unveils their latest High Speed/High Frequency connection solutions at Electronica 2018

Chant Sincere has been creating various of product families to provide comprehensive connection solutions to customers. USB Series Fakra Series QSFP Series Metric Connector Series Fibro ...


Addressing the energy challenge of IoT to unleash billions of devices

ON Semiconductor introduces various IoT use cases targeted towards smart homes/buildings, smart cities, industrial automation and medical applications on node-to-cloud platforms featuring ultra-low po...


ITECH, world leading manufacturer of power test instruments, shinned on electronica 2018

ITECH, as the leading power electronic instruments manufacturer, attended this show and brought abundant test solutions, such as automotive electronics, battery test, solar array simulator, and electr...


ITECH new series give users a fantastic user experience

ITECH latest series products have a first look at the electronics 2018, such as IT6000B regenerative power system, IT6000C bi-directional programmable DC power supply, IT6000D high power programmable ...


SOTB™ Process Technology - Energy Harvesting in Embedded Systems is Now a Reality

Exclusive SOTB technology from Renesas breaks the previous trade-off between achieving either low active current or low standby current consumption – previously you could only choose one. With S...


Power Integrations unveils their new motor control solution

In this video friend of the show Andy Smith of Power Integrations talks to Alix Paultre from Aspencore Media about their new BridgeSwitch ICs, which feature high- and low-side advanced FREDFETs (Fast ...


Panasonic talks about their automotive technology demonstrator

In this video Marco from Panasonic walks Alix Paultre of Aspencore Media through their automotive technology demonstrator at electronica 2018. The demonstrator highlights various vehicle subsystems an...



wholesale jerseys