ADLINK supports SGeT’s UIC with XRCE middleware for device-fog-cloud computing

ADLINK Technology announced its support for the Standardization Group for Embedded Technologies’ (SGeT) specification for a Universal Internet-of-Things Connector (UIC). In addition, ADLINK also announced advanced embedded middleware support that complements the UIC, with a ‘plug-in’ for XRCE real-time data distribution. Together, these two open-source software enhancements for ADLINK’s embedded products portfolio bring embedded computing firmly into the IoT arena, by enabling device-to-device and device-to-Cloud data connectivity - with standards-based inter-operability and performance levels never before possible with commercial-off-the-shelf products.

The UIC is SGeT’s first software-only standard. It supports the comprehensive roll-out of IoT applications by standardizing embedded hardware connectivity for Edge and Cloud Computing. Before UIC, all hardware I/O communication had to be done manually for each-and-every Edge and Cloud connection. This obviously created significant challenges for embedded hardware deployment, support and upgrade in distributed computing (e.g., IoT) systems.

Through the UIC, the integration of distributed devices is made easier via three levels of abstraction/partitioning. The UIC makes a distinction between: 1/ the device configuration (hardware identification, device mapping, value-to-information matching), 2/ the sensor and actuator communications (hardware driver), and 3/ the device communications (data transfer and processing). With more than 500 Cloud service offerings, and an even greater number of possible hardware configurations, this provides a very open, practical and efficient approach to building, deploying, maintaining and evolving IoT systems (i.e., integrated device-Edge-Cloud Computing).

The UIC will, out-of-the-box, support communications to hardware devices through the established Embedded API (EAPI) PICMG standard. This means that the whole ADLINK product portfolio of Computer-on-Modules and embedded boards will be able to leverage the UIC.

In addition to UIC support for its portfolio of devices, ADLINK is also announcing support for a XRCE data-connectivity ‘plug-in’, which leverages the UIC to provide high-performance peer-to-peer data communications between devices. XRCE stands for ‘eXtremely Resource-Constrained Environments’ and is a derivative of the Object Management Group’s (OMG) open-standard Data Distribution Service (DDS) specification. XRCE complements other IT and OT data protocols (e.g., MQTT and OPC/UA) but provides the more advanced real-time data-connectivity required for performance-critical distributed systems (e.g., the deterministic data delivery required for distributed robotics, autonomous vehicles, defense systems, etc.).

Furthermore, UIC and XRCE support the embedded computing industry’s requirement for dual-sourcing (with interoperability and exchangeability), that is, all modules and subsystems interoperating in a seamless way without vendor-specific knowledge. This supports important cost, time-to-market and risk-reduction initiatives by OEMs through, for example, reducing vendor lock-in and improving application code portability.

ADLINK will showcase its UIC/XRCE capabilities in a device-Fog-Cloud Computing demonstration at embedded world.

Latest News from ADLINK Technology

ADLINK honoured Edge Computing Company of the Year
ADLINK joins Open Networking Foundation as collaborating innovator
ADLINK: smart gateway selected for Michelin-SoftBank tire control system
ADLINK partners with FFG for 5G- and ROS2-based factories of the future
ADLINK: fanless Embedded computers with Windows 7 support
ADLINK demonstrates Fog Computing at embedded world
ADLINK brings ‘AI at the Edge’ with NVIDIA technology
ADLINK supports SGeT’s UIC with XRCE middleware for device-fog-cloud computing
ADLINK and MECSware to demonstrate Private LTE at Mobile World Congress
ADLINK at Embedded World 2018
ADLINK: insights on how to transform current factories into factories of the future
ADLINK: IIoT-ready rugged, compact IoT gateway/controller
ADLINK: hands-on demonstration of OpenRack, OpenSled infrastructure at Broadband World Forum
ADLINK: PCI/104-Express SBC provides three digital display interface channels

Bs&T at PCIM2018

powerlosstester presenting BsT-pulse 3 phase version and BsT-SQ for powerloss measurement of inductive components new findings of tester, the highest Bs ferrite material D9B for SiC application GaN fe...


Würth and AnDAPT describe their new programmable power solution

In this video an engineer from AnDAPT describes their new programmable power solution and their partnership with Würth at the APEC exhibition  in San Antonio, Texas. Drawing from Würth&...


MAGMENT: Magnetizable concretes, sole enablers for dynamic inductive wireless charging.

MAGMENT is a patented material technology, engineered from cement and magnetic particles from recycled electronic waste. We are the inventors and sole company worldwide to offer both the concrete mate...


A look at Analog Devices' wireless power demonstration at APEC 2018

In this video Steve from Analog Devices walks us through a wireless power transmission demonstration at APEC 2018 in San Antonio, Texas. The LTC4120 is a constant-current/constant-voltage wireless rec...


Analog Devices talks about their Power over Ethernet solutions at APEC

In this video Analog Devices talks about their Power over Ethernet solutions at APEC 2018 in San Antonio, Texas. Their LTC4291 provides four PSE Ports with two power channels per port, and is fully co...


Silicon Labs demonstrates their latest PoE solutions at APEC 2018

In this video John Wilson of Silicon Labs demonstrates their latest Power over Ethernet solutions at APEC 2018 in San Antonio, Texas. The live demonstration shows how a remote device can effectively p...


Vitrek explains their advanced testing solutions at APEC 2018

In this video Vitrek explains their advanced testing solutions at APEC 2018 in San Antonio, Texas. The devices displayed includes their 4700 high-voltage meter, which can measure up to 10kV and can pe...


Dirk Giesen describes the Parasoft tool suite for Embedded Software Development

Are you responsible for embedded software development in your organization? Your goal should be to create safe, secure, and reliable software. To make sure your device will work properly, deploy Paras...


Ross Sabolik of Silicon Labs talks about advanced Power over Ethernet

In this video Ross Sabolik of Silicon Labs talks about smart  Power over Ethernet systems with Alix Paultre at their APEC exhibit in San ANtonio, Texas. As PoE migrates to higher power levels and...


Dialog Semi walks through their latest IC solutions for battery chargers

In this video an engineer from Dialog Semiconductor walks us through their latest ICs for battery chargers at APEC 2018. Dialog's Qualcomm Quick Charge adapter solutions offer high efficiency to e...


Steve Allen of pSemi explains their latest LED driver solution

Steve Allen of pSemi explains their latest LED boost product based on Arctic Sand's two-stage architecture. Their PE23300 has a charge-pump, switched-capacitor architecture that offloads most of t...


Teledyne describes their latest 12-bit Wavepro HD oscilloscope

In this video Teledyne LeCroy describes their latest Wavepro HD oscilloscope to Alix Paultre of Power Electronics News at the company's launch event. The WavePro HD high-definition oscilloscope de...



wholesale jerseys