congatec: micro server carrier board enables 10GbE edge server designs

congatec introduces a deployment ready design study of a micro server carrier board with 10GbE support. The modular server board in the 5x5 inch Mini-STX form factor offers high scalability across all suitable embedded server processor sockets thanks to its COM Express Type 7 slot. This enables 10GbE edge node performance upgrades at lowest cost, as nearly all investments in the real-time system design of 10GbE edge nodes can be re-used. To upgrade the performance, OEMs and network operators only need to exchange the Server-on-Module. This is especially interesting for operators of 5G networks and edge data centers, who expect real-time performance demands to increase once 10GbE infrastructures become deployed more widely, leading to constantly lower revenues per processed data volume. Also, all IIoT, Industry 4.0 and fog server applications will require continuous performance upgrades as security, analytics and artificial intelligence demands will keep evolving for at least a decade to come.

The edge server board in the 5x5 Mini-STX form factor provides impressively high performance thanks to utilizing the COM Express Type 7 conga-B7AC module based on the Intel Atom C3000 processor. With processor power consumption starting at just 11W TDP, the system offers 4x real-time 10GbE network performance and up to 16 cores, which is ideal for processing many smaller packet sizes in parallel. Compared to other multi-core solutions, such as the Intel Xeon D processors, the costs and power consumption here are significantly lower; this makes it possible to roll out very high network bandwidths and storage capacities far into the industrial field.

The congatec micro server carrier board can be equipped with eight different Intel Atom server processor versions – from the 16-core Intel Atom C3958 to the quad-core C3508 processor for the extended temperature range. All offer up to 48GB of fast 2400 DDR4 memory, which can be designed with or without Error Correction Code depending on customer requirements. The 10GbE interfaces are standardly implemented via SFP+ cages, enabling network connection via both fiber optic and copper cables. In addition, the carrier board provides 2x 1GbE and 2x USB 3.0 interfaces for service and peripherals. One of the 1GbE ports is connected to the integrated board management controller and can therefore be used for server-typical remote management tasks.

The congatec micro server carrier board in the 5x5 Mini-STX form factor further offers a VGA output and a serial interface for local administration. For custom extensions, it provides three M.2 slots. Two of them are designed for M.2 2280 cards with key M and 4 PCIe lanes or 1x SATA, which makes them particularly suitable for storage media. The third M.2 slot accepts M.2 3042 cards with key A. With 2x PCIe, 1x USB 3.0 and I²C, it can connect both storage media and other peripherals. The feature connectors also provide GPIOs, I²C, SM and LPC buses.

More Information...

Latest News from congatec AG

congatec: COM Express Computer-on-Module with 3 GHz Intel Core i3 processor
congatec and Landshut University IoT Innovation Lab cooperate
congatec: first SMARC 2.0 module with NXP i.MX8 processor
congatec teams up with OSADL to optimize support for Real-Time Linux
congatec: COM Express Computer-on-Modules with 8th gen Intel Xeon and Intel Core processors
congatec: MIPI-CSI 2 platform for vision-based ticketing and access control
congatec: SMARC makes digital cockpit designs smarter
congatec: micro server carrier board enables 10GbE edge server designs
congatec introduces MIPI-CSI 2 Smart Camera Kit for rugged vision systems
congatec accelerates real-time hypervisor adoption for the embedded market
congatec: COM Express Type 6 module with AMD Ryzen embedded processors
congatec now listed on APLUS Système Automation’s line card
congatec supports new NXP i.MX8 processors on Qseven and SMARC modules
congatec presents virtualized fog server installation
congatec begins industrial market transition to 10 GbE bandwidth
congatec: quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec announces ComX standardization initiative

nVent Schroff at Embedded World 2019

The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...


Garz & Fricke Interview at Embedded World 2019 with Dr. Arne Dethlefs: We are strengthening our presence in North America

Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...


SECO's innovations at embedded world 2019

In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...


Design and Manufacturing Services at Portwell

Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...


Arrow capabilities in design support

Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...


Arm launches PSA Certified to improve trust in IoT security

Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...


DIN-Rail Embedded Computers from MEN Mikro

The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...


Embedded Graphics Accelerates AI at the Edge

The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...


ADLINK Optimizes Edge AI with Heterogeneous Computing Platforms

With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...


Synchronized Debugging of Multi-Target Systems

The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...


Smart Panel Fulfills Application Needs with Flexibility

To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...


Artificial Intelligence

Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...


Arrow’s IoT Technology Platform – Sensor to Sunset

Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...


AAEON – Spreading Intelligence in the connected World

AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...


Arrow as a Technology Provider drive Solutions selling approach

Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...


Riding the Technology wave

David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...


ASIC Design Services explains their Core Deep Learning framework for FPGA design

In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...


Microchip explains some of their latest smart home and facility solutions

In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...


Infineon explains their latest CoolGaN devices at electronica 2018

In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...


Analog Devices demonstrates a novel high-efficiency charge pump with hybrid tech

In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...


wholesale jerseys