SECO presents solutions for the IoT industry of tomorrow at Computex Taipei
At Computex Taipei 2019, SECO will present a comprehensive range of products mainly centered around SECO’s cross-platform vision and its modular solutions based on state-of-the-art technologies and standard form factors (Qseven, COM Express, and SMARC).
The complete Qseven-based product portfolio ranges from solutions featuring the NXP i.MX 8 Applications Processors - such as the Q7-C26, remarkable for its wide connectivity and rich M2M interface for onboard subsystems – or the NXP i.MX 8M Applications Processors (Q7-C25), to modules equipped with Intel Atom X Series, Intel Celeron J / N Series and Intel Pentium N Series (formerly Apollo Lake) Processors (Q7-B03) and Intel Atom E3800 and Celeron families (formerly Bay Trail) SoC (Q7-974).
The scalability of the COM Express form factor with the latest Intel platforms will be highlighted with three innovative products: the COMe-C55-CT6 - Compact COM Express Rel. 3.0 Type 6 module with 8th Gen Intel Core and Celeron U-series processors (formerly Whiskey Lake), the COMe-C24-CT6 - COM Express 3.0 Compact Type 6 Module with Intel Atom X Series, Intel Celeron J / N Series and Intel Pentium N Series (formerly Apollo Lake) Processors - and the COMe-C08-BT6 - COM Express with Intel 8th generation Core / Xeon (formerly Coffee Lake H). The COM Express Compact 3.0 Type 6 Module COMe-B75-CT6 with AMD Ryzen Embedded V1000 processors will be also showcased.
Among the highlighted solutions there will be the SM-B71, a SMARC Rel. 2.0 compliant module with Xilinx Zynq Ultrascale+ MPSoC. Unique for its blending of the ARM and FPGA domains, it delivers a flexible ARM + FPGA heterogeneous processing in a standard form factor, merging the cost-effective Dual-Core to high-performance Quad-Core ARM Cortex-A53 MPSoCs with GPU/VCU, granting extreme flexibility (up to 256k FPGA logic cells), vast scalability, and high-end performance all at once.
Not only hardware: a special focus will be on SECO's brand-new Industrial Internet of Things platform, an all-encompassing B2B service aiming at unleashing the customer’s full potential thanks to the power of AI and Big Data: mainly addressed to industrial enterprises, the service transforms the business into a fully-fledged Smart Industry.
Finally, SECO's booth will also include an area entirely dedicated to the company's latest creations in the realm of DIY electronics and open-source hardware: UDOO BOLT, an AI-first, high-performant SBC powered by AMD Ryzen Embedded V1000 SoC and also featuring an Arduino-compatible platform for sensing and programming the physical world, and UDOO X86II, the next-gen Intel x86 II open hardware SBC with Intel Quad Core 64 bit and Arduino Leonardo Microcontroller.