congatec AG has its head office in Deggendorf, Germany and is a leading supplier of industrial computer modules using the standard form factors Qseven, COM Express, XTX and ETX. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical technology, automotive supplies, aerospace and transportation. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. congatec currently has 112 employees and entities in Taiwan, USA and the Czech Republic. More information is available on our website at www.congatec.com.

Qseven™ - the mobile COM definition
Targeting next generation ultra mobile embedded processors built using 45 nm technology, the Qseven™ format complements the low power and small size of these processors. By taking advantage of the small form factor of the industry’s latest processors offerings, the Qseven™ format is able to deliver high performance computing in a module measuring only 70 x70 mm.

COM Express® - The concept
COM Express® is a PICMG standard that defines a Computer-On-Module, or COM, packaged as a super component. The defined interfaces provide a smooth transition path from legacy interfaces to LVDS (Low Voltage Differential Signaling) serial interfaces. This includes SDVO, PCI Express and Serial ATA.

XTX™ - "eXtended lifecycle for ETX®"
Based on the highly successful ETX® standard, XTX™ offers the newest I/O technologies on this proven form factor. Now that the ISA bus is being used less and less in modern embedded applications, congatec offers different features on the X2 connector instead of the ISA bus found on the ETX® platform. The X2 connector signals have been redefined in order to support PCI Express, SATA, LPC plus more, helping to guaranty longevity of the XTX™ standard.

ETX® - Embedded Technology eXtended
This well-established open standard fits the needs of embedded applications perfectly. The ETX® Standard offers complete PC functionality within the very compact size of 114 mm x 100 mm (4.5" x 4").

congatec Embedded BIOS
Embedded computers users usually require more than the standard functionality of an office computer. We at congatec have taken these requirements into account when designing our BIOS functionality. By drawing on the wealth of information that has been gathered as a result of more than 40 manpower years of combined experience in BIOS development, we have implemented the special requirements of an embedded BIOS into the congatec BIOS.

Product Links

Qseven

• conga-QA Qseven Module, Intel® Atom™ processor Z5xx series and Intel® USW15

• conga-QA6 - Ultra mobile module offering improved graphics performance and extended temperature range

• Accessories (Accessories and engineering tools specifically designed for Qseven)
• conga-QMX6 ( Freescale i.MX6 ARM Cortex A9 processor, extended temperature range, low power dissipation of less than 5W)
• conga-QAF ( Based on AMD Embedded G-Series Processors, best price/performance ratio, high performance graphics)

COM Express

• conga-BM57 (Maximum Computing COM Express™ Basic Module with Intel® HM55 chipset, Intel® Core i7 Processor, max. 8 GByte dual channel DDR3 memory)

• conga-BS57 (Maximum Computing COM Express™ Basic Module with Intel® HM55 chipset, Intel® Core i7 Processor, max. 8 GByte dual channel DDR3 memory)

• conga-BAF - Outstanding graphics performance with low power consumption - COM Express™ Basic Type 2 module based on AMD Fusion G-Series Processors
• conga-BE57 - COM Express module with ECC memory support for maximum reliability

• conga-BM45 (High End COM Express™ Basic Module with Intel® GM45/ICH9-M chipset, Intel® Core 2 Duo Processor, max. 8 GByte dual channel DDR3 memory)

• conga-BM67 -Extreme Graphics Performance COM Express™ Basic Type 2 module based on 2nd Generation Intel® Core™ processor family

• conga-BS45 (High End COM Express™ Basic Module with Intel® GS45/ICH9-M chipset, Intel® Core 2 Duo Processor, max. 8 GByte dual channel DDR3 memory)

• conga-CS45 (High End COM Express™ Compact Module with Intel® GS45/ICH9-M chipset, Intel® Core 2 Duo Processor, up to 4 GByte channel DDR3 memory)

• conga-B945 (Dual Core COM Express Module with Dual Channel Memory Support)

• conga-BA945 (Intel Atom COM Express Basic Module, up to 4GByte DDR2 channel memory)

• conga-B915 (COM Express / Intel® Celeron® M / Gigabit Ethernet)

• conga-CA (COM Express™ Compact Module Based on Intel® Atom™ processor Z5xx series)

• conga-CAx (COM Express™ Compact Module Based on Intel® Atom™ processor Z5xxPT series for extended Temperature)

• conga-CA6 - Ultra mobile COM Express Compact module offering improved graphics performance and extended temperature range

• Accessories (Accessories and engineering tools specifically designed for COM Express)

• conga-BS67 (High performance COM Express Basic Type 2 Module, Up to Low
  Power Intel® Core™ i7 2.2GHz processor, Heat Pipe based cooling solution)
• conga-CCA ( Next Generation Intel® Atom™ Dual Core Processors starting
  with 3.5 Watt power consumption, Excellent graphics performance, Equipped
  with the embedded firmware solution)
• conga-BS77 ( Highest Performance COM Express Type 2, 3rd Generation
  Intel® Core™ processors-based platform, Better transcode HD-HD, HD Video
  Conferencing, Improved Graphics Perfromance, DirectX®11)
• conga-TCA ( Next Generation Intel® Atom™ Dual Core Processors starting
  with 3.5 Watt power consumption, COM Express Type 6, Excellent graphics
  performance, Equipped with the embedded firmware solution UEFI)
•  conga-TFS ( Power efficient high-performance x86 processing,
  Unprecedented integrated graphics performance, High performance parallel
  processing support)
• conga-TM67 ( High Performance COM Express Basic Type 6 Module, Up to
  Intel® Core™ i7 quad core processor, Heat Pipe Cooling Solutions)
• conga-TS67 ( Based on 2nd Generation Intel® Core™  low-power processors
  in a small form factor (SFF) BGA package, Soldered CPUs for higher shock
  resistance, Ideal solution for demanding graphics applications)
• conga-TS77 ( Highest Performance COM Express Type 6, 3rd Generation
  Intel® Core™ processor-based platform, Better transcode HD-HD, HD Video
  Conferencing, Improved Graphics Performance, DirectX®11)

XTX

• conga-X945 (Dual Core XTX embedded CPU module with 4 PCI Express lanes and SATA)

• conga-XA945 (Intel Atom XTX Module, up to 2GByte DDR2 channel memory)

• conga-X915 (XTX embedded CPU module with 4 PCI Express lanes and SATA)

• conga-XAF - Outstanding graphics performance with low power consumption - COM Express™ Basic Type 2 module based on AMD Fusion G-Series Processors

• conga-XLX (AMD Geode LX 800 embedded XTX module with SATA and Suspend to RAM)

• Accessories ( Accessories and engineering tools specifically designed for XTX)

ETX

• conga-EAF - Outstanding graphics performance with low power consumption - COM Express™ Basic Type 2 module based on AMD Fusion G-Series Processors

• conga-ELX (ETX® Embedded Computer Module based on AMD Geode LX 800)

• conga-EL Xeco (ETX® Embedded Computer Module based on AMD Geode LX 800, onboard DRAM, PCI2ISA Bridge, eco version)

• Accessories (Accessories and engineering tools specifically designed for ETX)