Scan Engineering Telecom
images/stories/logos/set.jpg
Elisabethstrasse 91
80797 Munich
Germany
Tel: +49 89 5908 2347
Fax: +49 89 5908 1200
sales@setdsp.com
www.setdsp.com

Scan Engineering Telecom is a leading company in the design and development of high performance AdvancedMC™ (AMC),

AdvancedTCA ® (ATCA), MicroTCA™,  CompactPCI™, PCI™ and PCI-Express™ solutions. Our products are intended to use in telecom/datacom, industrial automation and aerospace applications. In our products we use forefont technologies from Intel, Xilinx, Texas Instruments and many other companies.

Scan Engineering Telecom was established in 1991. Now we have offices in Munich, Germany and Voronezh, Russia.

We have a wide portfolio of standard-based products and offer services for semi-/full custom board-level and platform-level development and system integration.

Scan Engineering Telecom is a member of PICMG. Additional information about our company and our products are available at our Web site  www.setdsp.com

Modules overview

AdvancedMC modules

  • Processor modules
  • Storage modules
  • Video modules
  • DSP modules
  • I/O modules
  • Serial I/O modules
  • Hardware accelerators
  • Packet-processing modules

MicroTCA modules

  • MicroTCA Carrier Hubs
  • Power modules

CompactPCI modules

  • DSP modules

PCI / PCI Express modules

  • DSP modules

Submodules

  • Submodules for AdvancedMC modules
  • Submodules for PCI modules

 

Systems overview

  • MicroTCA platforms

 

GE Developers Conference - June 13 in Munich

This years GE Developers Conference will focus on the Internet of Things and the role of embedded technology. The conference is designed by developers for developers where industry experts discuss and present the latest developments in the fields of embedded CPU tech­nology, connectivity and security.

ARM-based Embedded System Design 2013

ARM-based systems are rapidly gaining popularity in the Embedded Market. This one-day conference with table-top exhibition aims to provide a comprehensive overview about new products, technologies and strategies for ARM-based Embedded System Design.

 ti-workbench promo

Welcome to the TI workbench experience.

Learn more about hot TI topics and cool technology solutions at our hands-on demo presentations.

 

Solutions Directory - Q7 Modules

 
IFC-9400 Low Power Qseven Computing Platform    IFC-9400 Low Power Qseven Computing Platform
The Inforce IFC-9400 board delivers an extremely cost-effective platform solution for mobile application developers in a true Qseven™ compatible form factor. This compact, high-performance mobile computing platform can be immediately deployed in existing Qseven slots or used as the core processor...
H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T    H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T
The H6055 is an extremely compact (70 mm x 70 mm) high-performance, ultra-low power COM module based on the Intel® Atom™ E600 series CPUs and the Intel® Platform Controller Hub EG20T. The form factor is Qseven, and H6055 is compliant with...
conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15    conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15
Mobile Applications: QSeven is unlike previous Computer-On-Modules (COM) standards due to its primary focus being directed towards mobile and ultra mobile applications. It defines fast serial differential...