SECO SRL
images/stories/logos/seco.jpg

Via Calamandrei, 91
52100 Arezzo
Italy
Tel: +39 0575 26979
Fax: +39 0575 350210
E-Mail: info@seco.com

www.seco.com

www.seco.com

Seco, International company leader in the electronic embedded solutions, over its 30 years has shown the capability to adapt its know-how to meet the new challenging customer needs guiding the customer to its most innovative solutions. Conscious of its strong know-how in countertrend to the recent outsourcing policy, SECO up till now has managed the entire phase of its production cycle from the first sketch to mass production in Italy, exclusively.

Strong in its feelings for new innovative solutions, for researching and designing thanks to the collaboration with important scientific Universities and partnership with the worldwide leading companies, they have contributed to transform Seco in an International reality that have owned the market based on the new challenges of the ordinary days.

SECO product line includes Qseven, COM Express, Single Board Computers, ETX, XTX and Custom products. With long-life product orientation SECO place its thirty years of know how at disposal of customer specific purposes in different fields of applications: from industrial to medical, from automotive to telecommunications, from infotainment to gaming.

 

Qseven™

Qseven™ standard has shown itself, in the embedded market, as the most compact & cost efficient Computer On Module of the year. The design flexibility of Qseven™ architecture is the same of the other COMs like ETX®, XTX™ or COM Express™: replacing the board it is possible to diversify the product range through the use of different architectures. Qseven™ standard features PCI Express®, xpressCard®, Serial ATA®, Secure Digital I/O interface, DisplayPort™ (or TMDS or SDVO) interfaces, USB 2.0, High Definition Digital Audio, LPC interface, Gigabit Ethernet, LVDS Display interface. All the signals arrive to the carrier through a 230 pins MXM connector. SECO provides complete system solutions with Qseven™.

Products in evidence:

 

COM Express

High – End Bandwidth For High – End Performances COM (Computer on Module) Express™ is a standard form factor introduced in year 2005 by PICMG. This standard is
an answer to the market request for more flexibility and the adoption of the latest technology improvements available from CPUs and Chipsets. The COM Express™ module is available in 2 formats: the Basic Form Factor, with dimensions of 125 x 95 mm, which is suited for highly power sensitive, small devices, and the Extended Form Factor, with dimensions of 155 x 110 mm, which is a good choice for applications where performance (most of all the graphics) is more important than low power dissipation. COM Express™ is also designed to accomodate next generations of PCI Express (5 GHz) and Serial ATA (300 Mbps) interfaces, doubling the data rates of actual generation. This is a feature that will surely establish this form factor and enables an easy technology update to the final applications. Furthermore the design flexibility is the same as for the ETX® CPU modules, since it’s a COM solution: it’s possible to design a product with different CPUs using the same carrier board and mechanics and the product upgrade is simply reached through a CPU module change and as a result time-to-market is shortened.

Products in evidence:

 

SBC

Clever Turn-key Solutions SECO EMBEDDED Single Board Computers (SBCs) products line includes a wide range of standard architectures: PC/104® (with or without plus bus or expansions modules for additional I/O), Mini-ITX, Nano-ITX and EPIC™ form factors. Applications are typically gaming (slot or video poker machines), digital signage (kiosks or info-point devices) and industrial (control processes machines). SECO SBCs are providing all the required I/O more targeted to an industrial application such as on-board digital and analog I/O, on-board bootable flash, no on-board video, coin counters, printers and so on. In the case of PC104, the bus is a stackable solution with a pin connector allowing I/O boards to be added to the whole system. Single board computers are commonly compact and with an high level of integration (customizable) together with their low power consumption SECO provides boards which represent a key choice for a wide range of applications and new projects. Plug-cards such as DIMMs or storage units, cables and display interfaces along with pre-loaded operating systems are offered to complete the system in turn-key solutions granted for a long term availability.

Products in evidence:

 

ETX

The ETX® (Embedded Technology eXtended) architecture is based upon 2 elements: the ETX® CPU Module and the ETX® Baseboard. The ETX® CPU modules have a compact size ( 95x114mm) and 4 standard high density connectors through which ISA bus, PCI bus and the most common I/O signals in a PC are conveyed to the ETX® Baseboard. The connectors are placed on the baseboard which is generally designed on customer’s requirements. About the ETX® baseboards, SECO provides solutions off-the-shelf but also offers its know-how for the design of custom baseboards. This solution enables the customer to maintain the same mechanics or the chassis where the embedded CPU system is positioned and diversify or update the performances of the product simply changing the ETX® CPU module. Another possibility is to offer a wider range of final products offering different performances simply using different CPU modules, avoiding additional design costs. The thermal dissipation of the system strictly depends on the mechanics of the final system and the mounted CPU: from the standard heat spreader kit through heat sinks, fans or heat pipes. Flexible and tailored solutions are the benefits of an ETX® system.

Products in evidence:

 

XTX

The XTX™ (eXpress Technology for ETX® ) architecture is based, like the one of ETX®, by 2 elements: the XTX™ CPU Module and the XTX Baseboard. XTX™ was developed as an evolution of the ETX® standard, with same form factor of 95x114mm and same 4 standard high-density connectors through which the signals are conveyed to the Baseboard, but adding new features. Following the trend of the new I/O technologies, XTX® removes the ISA signals, a bus less and less used in modern embedded applications, and adds the new high-speed serial buses like PCI Express™ and Serial ATA®. The philosophy of the XTX™ architecture remains the same of the ETX®: flexibility in offering different performances in the final application and/or easy upgrade of performances simply using different CPU modules, avoiding additional design costs. The thermal dissipation of the system strictly depends on the mechanics of the final system and the CPU mounted and implies the same solutions of the ETX® systems. SECO provides its know-how in developing and manufacturing Baseboards also for the XTX™ standard, in order to supply to the customer a complete embedded PC system, for fastest and easiest integration on the customer’s site.

Products in evidence:




Latest Articles, Webinars & more from SECO SRL

 

GE Developers Conference - June 13 in Munich

This years GE Developers Conference will focus on the Internet of Things and the role of embedded technology. The conference is designed by developers for developers where industry experts discuss and present the latest developments in the fields of embedded CPU tech­nology, connectivity and security.


ARM-based Embedded System Design 2013

ARM-based systems are rapidly gaining popularity in the Embedded Market. This one-day conference with table-top exhibition aims to provide a comprehensive overview about new products, technologies and strategies for ARM-based Embedded System Design.


 ti-workbench promo

Welcome to the TI workbench experience.

Learn more about hot TI topics and cool technology solutions at our hands-on demo presentations.


 

Solutions Directory - Q7 Modules

 
IFC-9400 Low Power Qseven Computing Platform    IFC-9400 Low Power Qseven Computing Platform
The Inforce IFC-9400 board delivers an extremely cost-effective platform solution for mobile application developers in a true Qseven™ compatible form factor. This compact, high-performance mobile computing platform can be immediately deployed in existing Qseven slots or used as the core processor...
H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T    H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T
The H6055 is an extremely compact (70 mm x 70 mm) high-performance, ultra-low power COM module based on the Intel® Atom™ E600 series CPUs and the Intel® Platform Controller Hub EG20T. The form factor is Qseven, and H6055 is compliant with...
conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15    conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15
Mobile Applications: QSeven is unlike previous Computer-On-Modules (COM) standards due to its primary focus being directed towards mobile and ultra mobile applications. It defines fast serial differential...