Category "Development Tools SW"
Wide Band Gap Semiconductors will be in the focus of our Power Electronics Conference on the 5th of December 2017 in the Hilton Hotel at Munich Airport. Wide Band Gap Devices have been taken over more and more of historically served areas of silicon devices within the last years. The Conference is a great place to meet Experts and share expertise to taking down boarders and overcome hesitation using these new semiconductors.
Latest Webinars, White Papers & more
The Flash market prepares to standardize on new low-voltage ICs. In this webinar you will learn about Winbond’s high-performance serial Flash ICs that operate from supply voltages as low as 1.2V.
Selecting the right coding standard is an essential building block for safe and secure coding. This white paper looks more closely at the details that need to be considered so that the coding standard chosen is fit for purpose.
Winbond’s ultra-low voltage serial NOR Flash memory can work between 1.14V to 1.60V, which covers most of the single AA battery operation voltage range. The lower Vcc can reduce the power consumption in read operation, improve the system BOM cost and reduce the noise coupling in data bus.
Many companies do not want to see their entire production data and know-how to be stored and processed outside the companies’premises. The proven solution to this challenge are approaches like edge and fog computing. In this webinar you will learn how modular systems based on the well-established and tested COM Express modules provide an efficient solution.
This webinar will review laminated busbar designs and advise some techniques on how to optimize design by avoiding common mistakes. The webinar is beneficial for mechanical and electrical engineers involved in developing inverters, battery systems and other critical applications.
Supporting safety critical applications is at the core of car-to-car communication, and for years, the technology of choice has been IEEE802.11p. Recently, a new standard has started evolving: LTE-V2V. This White Paper compares the two standards on which the safety of millions of road users will depend on.
In this webinar we discuss three TI reference designs that help designers create smart technology that can be integrated into smart home ecosystems. These designs are easy to retrofit into existing homes.
This webinar will show how the Ada language can help you design, implement and verify embedded software that will be reliable, safe and secure, while still meeting its performance requirements.
This webinar will show how advanced magnetic components help to realize product safety, reliability and high performance for the evolving electric vehicle charging infrastructure. The focus will be on all relevant EV charging modes covering AC charging via IC-CPD or wall box (Modes 2 & 3), as well as DC fast charging (Mode 4) and Inductive charging.
In this webinar, we present you the new CoolSiC MOSFET technology which is enabling radically new product designs and offering a series of advantages compared to the tradtional Si based switches. In this webinar you will learn more about the features and benefits CoolSiC MOSFET products are providing.
Embedded software developers normally are applying defect prevention techniques early in the lifecycle. But the demand for IoT requires a new testing paradigm that more closely resembles the challenges that Enterprise IT have faced for decades.
Harness manufacturing is a low margin business where quality, accuracy, and speed are essential to success. It can benefit from a full, automated and digitally continuous flow from product design to harness manufacturing.
Designing embedded computer platforms that can cope with extremes in temperature, vibration and humidity demands a focused approach to quality. Delivering truly rugged solutions requires a focused strategy that begins with R&D and ends with robust products.
Soft-switching techniques are an interesting solution in switched mode power supplies to achieve high efficiency at high switching frequencies. This webinar focuses on Phase-Shift Zero Voltage Switching (PS ZVS) topology, with special attention on the benefits of using 1200 V silicon carbide (SiC) power devices in comparison to counterpart silicon IGBTs.
We have put together for you a Microsite with White Papers and E-Books about the digital transformation for the Manufacturing Industry and how Windows 10 can help to drive this transformation.
The thermal solution for transceiver cooling in an outdoor environment yields an optimal solution to maintain form factor and minimize latency of a remote radio unit. Laird’s ATC line of miniature form factor thermoelectric assemblies provide the size and the cooling accuracy needed to obtain peak performance.
CrossLink is an innovative video bridging solution. This White Paper describes five new applications for Crosslink_ three represent an emphasis on new video bridging solutions, two are traditional interface conversion.
This webinar presented by Siemens PLM Software will show how embedded software development can evolve successfully through a unified Application Lifecycle Management (ALM) - to be unlike your development experience before.
Our 3 E-Mail Newsletters: EETimes/EDN Europe, Embedded News & Know-how and Power Electronics News & Know-how inform about the latest news in technology and products, as well as technical know-how like white papers, webinars, articles, etc.
B & S / ECE Magazine
- latest issue is online now -
Combining flash storage and security meets industrial requirements