Latest issue of ECE Magazine

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The bi-montly ECE Magazine is the leading Pan-European publications for Embedded Engineers. It provides technical articles and product news f about Microcontrollers, Microporcessors & DSPs, Development Tools, RTOS, Analog & Power and FPGAs.

The ECE magazine is available as digital version and also in print format. The print version combines ECE and Boards & Solutions in a single magazine. ECE is distributed free of charge to qualified readers:

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Back issues of ECE Magazine
	ECE Magazine (March/April 2013) Download as Electronic Magazine in PDF Format
	ECE and B&S Magazine (Embedded World 2013) Download as Electronic Magazine in PDF Format
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	March 2010 issue of CE Magazine Download as Electronic Magazine in PDF Format
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	December 2009 issue of ECE Magazine (Chips & Tools Yearbook) Download as Electronic Magazine in PDF Format
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GE Developers Conference - June 13 in Munich

This years GE Developers Conference will focus on the Internet of Things and the role of embedded technology. The conference is designed by developers for developers where industry experts discuss and present the latest developments in the fields of embedded CPU technology, connectivity and security.

ARM-based Embedded System Design 2013

ARM-based systems are rapidly gaining popularity in the Embedded Market. This one-day conference with table-top exhibition aims to provide a comprehensive overview about new products, technologies and strategies for ARM-based Embedded System Design.

Welcome to the TI workbench experience.

Learn more about hot TI topics and cool technology solutions at our hands-on demo presentations.

Solutions Directory - Q7 Modules
		IFC-9400 Low Power Qseven Computing Platform The Inforce IFC-9400 board delivers an extremely cost-effective platform solution for mobile application developers in a true Qseven™ compatible form factor. This compact, high-performance mobile computing platform can be immediately deployed in existing Qseven slots or used as the core processor...
		H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T The H6055 is an extremely compact (70 mm x 70 mm) high-performance, ultra-low power COM module based on the Intel® Atom™ E600 series CPUs and the Intel® Platform Controller Hub EG20T. The form factor is Qseven, and H6055 is compliant with...
		conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15 Mobile Applications: QSeven is unlike previous Computer-On-Modules (COM) standards due to its primary focus being directed towards mobile and ultra mobile applications. It defines fast serial differential...

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DESIGNER'S COLUMN

Maximize uptime in the connected factory
Monitoring the many devices that keep today's production lines running in optimal condition is a major challenge. This article will explain how the fanless industrial computers NISE 3640 can be used as a control and communication gateway that links cross automation hierarchy levels to monitor and control the devices connected to it in real time.

Dual-channel colorimeter with programmable gain transimpedance amplifiers and synchronous detectors
This “Circuits from the Lab” paper introduces a dual-channel colorimeter with programmable gain transimpedance amplifiers and synchronous detectors that measures the ratio of light absorbed by the sample and reference containers at three different wavelengths.

Solutions for Sensing Applications
During this webinar, participants will receive an overview on different sensor applications and TI solutions to support them. Through various concrete examples the session will detail the sensing principles and the main design challenges involved.

Benchmarking of in-memory & on-disk databases
Will an IMDS (in-memory database system) with transaction logging outperform a traditional DBMS? Will type of storage – hard disk drive vs. SSD vs. state-of-the-art memory-tier device – affect any performance difference? McObject’s benchmark report answers these questions.

Computer systems for railway applications
More and more electronic systems are being built into trains, the underground, streetcars and buses. If you talk about the overall railway engineering market, you don’t only mean vehicles – in which areas and applications can one find these computers and which functions do they take over? And why are they so different to the office PC or the one at home?

CompactPCI Serial
As you can see in our free Virtual Seminar, CompactPCI® Serial can be used from simple industrial PCs to clustered, redundant high-end systems, from harsh environments till safety critical, supporting Ethernet, USB, SATA and PCI Express in parallel.

Isolated interface solutions for industrial sensor and monitoring applications
This webinar reviews designs in which isolation is needed to protect personnel and equipment from harsh electrical environments. Presentation will detail interface power requirements and approaches for achieving design objectives.

It’s all about ARM
We have put together for you a selection of 5 new webinars which cover following topics: “FPGA fabric and Cortex-A9 on the same chip”, “smallest ARM-based microcontroller”, “8-bit price for 32-bit power”, “the next milestone of the mbed project” and “overview about Infineon XMC Kits”.

Efficient remote management for embedded platforms
Out of Band (OOB) remote management can help to optimize the total cost of ownership of distributed embedded platforms. However, existing implementations are normally too costly for embedded systems applications.

Intelligent device platform for M2M applications
Connecting a device to the cloud means to focus on three main issues: security, manageability, connectivity. Listen into how Wind River contributes to successfully develop devices for M2M applications.

Reloadable user interfaces with EB GUIDE and HTML5
The focus of this webinar is on the latest advancements in infotainment and whether HTML5 is the right solution to the infotainment technology.

Smart Grid
The promise of the smart grid is a more efficient, reliable, flexible and safe energy distribution system. But there are many challenges too. This Virtual Seminar provides technical presentations and white papers about solutions which can help to solve the challenges of the Smart Grid.

Latest issues of B&S and ECE Magazine

ECE Magazine

Cover Story:
Partitioning a single-chip system for safe and non-safe applications

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B&S Magazine

Cover Story:
AMD G-Series SOC integrates CPU, GPU and I/O controller onto a single die

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Latest issue of ECE Magazine

Download here the digital version of the latest issue of ECE Magazine

Back issues of ECE Magazine

ECE Magazine (March/April 2013)

ECE and B&S Magazine (Embedded World 2013)

ECE Magazine (December 2012)

ECE Magazine (electronica 2012)

ECE Magazine (September 2012)

ECE Magazine (August 2012)

ECE Magazine (June/July 2012)

ECE Magazine (May 2012)

ECE Magazine (March/April 2012)

ECE Magazine (February 2012)

ECE Magazine (November 2011)

ECE Magazine (October 2011)

ECE Magazine (September 2011)

ECE Magazine (August 2011)

ECE Magazine (June 2011)

ECE Magazine (May 2011)

ECE Magazine (Mar/April 2011)

ECE Magazine (February 2011)

ECE Magazine (December 2010)

ECE Magazine (November 2010)

ECE Magazine (October 2010)

ECE Magazine (September 2010)

ECE Magazine (August 2010)

ECE Magazine (June 2010)

ECE Magazine (April 2010)

March 2010 issue of CE Magazine

February 2010 issue of ECE Magazine

December 2009 issue of ECE Magazine (Chips & Tools Yearbook)

November 2009 issue of ECE Magazine

September 2009 issue of ECE Magazine

August 2009 issue of ECE Magazine

June 2009 issue of ECE Magazine

April 2009 issue of ECE Magazine

March 2009 issue of ECE Magazine

February 2009 issue of ECE Magazine

GE Developers Conference - June 13 in Munich

ARM-based Embedded System Design 2013

Welcome to the TI workbench experience.

Solutions Directory - Q7 Modules

December 2009 issue of ECE Magazine
(Chips & Tools Yearbook)