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6th/7th Gen Intel® Core® Mini-ITX for Advanced Computing & Graphics

The AmITX-SL-G enables high-level processing and graphics performance solutions with 7-year product life for small footprint applications. With extensive I/O options it serves as an ideal base for scalable system integration.

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Latest Webinars, White Papers & more

8 Ways to Improve Harness Manufacturing

Harness manufacturing is a low margin business where quality, accuracy, and speed are essential to success. It can benefit from a full, automated and digitally continuous flow from product design to harness manufacturing.

Embedded Computing for Extreme Environments

Designing embedded computer platforms that can cope with extremes in temperature, vibration and humidity demands a focused approach to quality. Delivering truly rugged solutions requires a focused strategy that begins with R&D and ends with robust products.

Benefits of SiC MOSFETs in Soft-Switching Topologies

Soft-switching techniques are an interesting solution in switched mode power supplies to achieve high efficiency at high switching frequencies. This webinar focuses on Phase-Shift Zero Voltage Switching (PS ZVS) topology, with special attention on the benefits of using 1200 V silicon carbide (SiC) power devices in comparison to counterpart silicon IGBTs.

Digital Transformation for the Manufacturing Industry

We have put together for you a Microsite with White Papers and E-Books about the digital transformation for the Manufacturing Industry and how Windows 10 can help to drive this transformation.

Active Cooling of Optical Transceivers

The thermal solution for transceiver cooling in an outdoor environment yields an optimal solution to maintain form factor and minimize latency of a remote radio unit. Laird’s ATC line of miniature form factor thermoelectric assemblies provide the size and the cooling accuracy needed to obtain peak performance.

Video bridging use cases based on CrossLink programmable ASSPs

CrossLink is an innovative video bridging solution. This White Paper describes five new applications for Crosslink_ three represent an emphasis on new video bridging solutions, two are traditional interface conversion.

The Next Level of Embedded Software Development

This webinar presented by Siemens PLM Software will show how embedded software development can evolve successfully through a unified Application Lifecycle Management (ALM) - to be unlike your development experience before.

Connectivity, Security and the Industrial Internet of Things

Today, a wide range of connected Embedded Systems is available on the market. And the Industrial Internet of Things (IIoT) is driving the addition of more connected devices. But not only “Connectivity” is essential to the success of the IIoT, “Security” is critical too.

Turning Signal Integrity Simulation Inside Out

What does it mean to turn signal integrity simulation inside out? - ANSYS is pursuing a strategy in which electromagnetic simulation is primary and circuit analysis supports the electromagnetic solution, rather than the other way around.

Choosing Inductors for Energy Efficient Power Applications

Designing for highest efficiency performance requires se­lection of inductors with the lowest total loss at application conditions. Calculating total loss can be complicated, but these calculations are built into the Coilcraft power mag­netics tools, making selection, comparison, and analysis as simple as possible.

Thermal Management for Semiconductor Metrology Equipment

Today, automated metrology systems are implemented throughout the thin film semiconductor manufacturing process. In this paper we will review the emerging trend for metrology systems and the implications for their associated thermal management systems.

How to improve SMPS design in terms of performance, usability and costs

This webinar from Infineon will show design engineers how to improve SMPS design in terms of performance, usability and pricing demands. Infineon offers a one-stop-shop service in selecting highly optimized high voltage MOSFETs for various SMPS applications.

3 steps to select the right DBC / AMB substrates for your application

Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) ceramic substrates are the most popular substrates for the assembly and packaging of IGBT and MOSFET bare dies in power modules. As a designer of power modules, you will have to select the right substrate for your application.

Secure Software Licensing for Industry 4.0

The future of the industry is digital and intelligent. At the core of the new infrastructure, we find Cyber Security 4.0 and Digital Business 4.0, both facilitated by CodeMeter Embedded 2.0. The brand new generation of CodeMeter Embedded provides a broad spectrum of new features like an extremely compact footprint, established compatibility with embedded systems and PLCs and wider compatibility with platforms and operating systems.

How Wind River VxWorks RTOS helps to meet the challenges for connectivity, safety, and security

On this Microsite we have put together for you a collection of on-demand Webinars, White Papers, and more which will show how Wind River’s VxWorks can help you to meet the challenges driven by the need for greater connectivity, intelligence, safety, and security.

Using digital isolators in precise analog measurement systems - What designers need to care about

Ground shift is a common problem in industrial applications. It is typically solved with optocouplers or digital isolators. In this webinar, we specifically look at the problems which ground shift causes in precise analog measurement systems.

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E-Mail Newsletters

Our 3 E-Mail Newsletters: EETimes/EDN Europe, Embedded News & Know-how and Power Electronics News & Know-how inform about the latest news in technology and products, as well as technical know-how like white papers, webinars, articles, etc.

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B & S / ECE Magazine - latest issue is online now -
July 2017	Content Highlights Cover Story Assured performance in extreme environments Download now

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