Expanding its broad portfolio of analog and digital power management solutions, Texas Instruments introduced an integrated and configurable digital power management controller optimized for AC/DC and isolated DC/DC power supply applications. The UCD3138 gives designers an innovative path to increase power density and reliability in a broad range of power supply topologies used in servers, telecom rectifiers and high-power DC/DC modules.
Digital control capabilities allow designers to do more with their power systems, including re-usability of hardware designs across multiple platforms and the versatility to fine-tune performance and control parameters for each application, allowing faster time to market. To enable this, the UCD3138 combines a powerful 32-bit microprocessor, high-speed precision data converters, multiple programmable hardware control loops and various communication engines in a small 6-mm x 6-mm package. The device features several control functions to increase efficiency, including sync-FET soft on-off control, dynamic phase shedding, dynamic frequency adjustment and dynamic mode switching. The controller supports single-phase, two-phase interleaved, or bridgeless power factor correction, hard-switching full-bridge, phase-shifted full-bridge, resonant LLC and other topologies.The device implements peak current mode control, cycle-by-cycle peak current limiting, high-speed input voltage feed-forward, over-voltage, over-current and over-temperature protection.
Designers will have easy access to several digital power development tools including full-voltage and feature-rich evaluation modules, development kits, reference designs, application firmware source code, programmer’s manuals and the Code Composer Studio software development environment. TI’s Fusion Digital Power Designer GUI software tool provides flexible configuration of key power parameters, as well as telemetry, logging, and communication functions. A broad range of hardware design tools, such as control card and open-loop evaluation modules, are available to select customers. In addition TI offers easy-to-use development kits and reference designs.
The UCD3138 is sampling now with volume production expected in the second quarter. It comes in a thermally enhanced 40-pin, 6 x 6-mm QFN package and supports a temperature range of -40 to 125°C. A 64-pin, 9 x 9-mm QFN version of the UCD3138 is also available.
