GE Intelligent Platforms

Homepage: www.ge-ip.com

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GE: rugged COM Express module for multi-display applications

GE Intelligent Platforms announced the latest addition to its growing range of COM Express modules with the launch of its highest performance offering to date, the rugged bCOM6-L1400. Taking advantage of the significant processing and graphics capabilities of the recently-announced Intel Core i7 processor, the bCOM6-L1400 can support multiple independent displays in a wide variety of commercial, industrial, transportation and defense applications in a broad range of embedded computing environments.

By separating the carrier card from the processor, the COM Express architecture extends the useful life of the subsystem by allowing simple, cost-effective upgrade of the processor alone. This reduces long term cost of ownership while ensuring that performance keeps pace with changing needs.

Offered with a choice of either a dual-core or quad-core processor for maximum flexibility and enabling customers to select the optimum price-performance/watt combination for the planned application, the bCOM6-L1400 takes advantage of GE’s extensive experience and expertise in the design and development of rugged COM Express modules. It also complements GE Intelligent Platforms’ extensive portfolio of rugged embedded computing solutions that includes single board computers, multiprocessors, Ethernet switches, displays and networking. The bCOM6-L1400 can be confidently deployed in the harshest, most challenging environments that are subject to extremes of temperature, vibration, shock and contaminants. Its components are specifically selected for reliable operation in hostile environments, and the processor and memory are soldered to the board for the highest possible resistance to external forces.

Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes. Sophisticated dynamic thermal management optimizes uptime and helps prevent damage to the system. GE is able to provide customers with the support necessary to enable them to develop their own carrier card configurations, or to provide custom carrier card variants on request. This ability provides significant flexibility to systems integrators looking to create unique, high value-added solutions. As well as its graphics capabilities (VGA, LVDS with dual channel support and SDVO/TMDS/DisplayPort over DDI), the bCOM6-L1400 features up to 8GBytes of DDR3 memory, Gigabit Ethernet and four SATA interfaces, with support for both RAID 0 and RAID 1. Also provided for optimum connectivity are eight USB 2.0 ports and four USB 3.0 ports.

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Solutions Directory - Q7 Modules

 
IFC-9400 Low Power Qseven Computing Platform    IFC-9400 Low Power Qseven Computing Platform
The Inforce IFC-9400 board delivers an extremely cost-effective platform solution for mobile application developers in a true Qseven™ compatible form factor. This compact, high-performance mobile computing platform can be immediately deployed in existing Qseven slots or used as the core processor...
H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T    H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T
The H6055 is an extremely compact (70 mm x 70 mm) high-performance, ultra-low power COM module based on the Intel® Atom™ E600 series CPUs and the Intel® Platform Controller Hub EG20T. The form factor is Qseven, and H6055 is compliant with...
conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15    conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15
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