WinSystems: PC/104-size Gigabit Ethernet module with SUMIT PCIe

WinSystems announces a SUMIT-ISM compatible Gigabit Ethernet module designed for high-speed networking connectivity for small form factor, industrial embedded applications.  The PXM-GIGE is a 90 x 96mm module that connects to 10/100/1000 Mbps networks using standard Category 5 unshielded twisted pair copper cables.  It offers a stackable PCI Express expansion on a PC/104 module with the addition of the industry-standard high-speed SUMIT connector.  It plugs directly into WinSystems’ PXM-C388-S, a 1.66HGz Atom N455-based SBC as well as other SUMIT-ISM compatible products available elsewhere.

The PXM-GIGE is based upon the Intel 82573 controller whose architecture is optimized to deliver both high-performance and PCIe bus efficiency with the lowest power and smallest size.  The 82573 efficiently handles packets with minimum latency by combining a parallel and pipelined logic architecture optimized for Gigabit Ethernet and independent transmit and receive queues.  Also IEEE 802.3ab Auto-Negotiation, IEEE 802.3x-compliant flow control, adaptive equalization, echo cancellation, and crosstalk cancellation are supported as well. The PXM-GIGE module is wired to the x1 PCIe lane of the SUMIT-A connector and automatically selects the first available link.  The PC/104 connector is supported for legacy stacks.  It requires only +5 volts at 0.67A and will operate from -40 to +85°C. The PXM-GIGE supports Linux, Windows, and other x86-compatible real-time operating systems.  Free drivers are available from the WinSystems’ website.


 
 

GE Developers Conference - June 13 in Munich

This years GE Developers Conference will focus on the Internet of Things and the role of embedded technology. The conference is designed by developers for developers where industry experts discuss and present the latest developments in the fields of embedded CPU tech­nology, connectivity and security.


ARM-based Embedded System Design 2013

ARM-based systems are rapidly gaining popularity in the Embedded Market. This one-day conference with table-top exhibition aims to provide a comprehensive overview about new products, technologies and strategies for ARM-based Embedded System Design.


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Welcome to the TI workbench experience.

Learn more about hot TI topics and cool technology solutions at our hands-on demo presentations.


 

Solutions Directory - Q7 Modules

 
IFC-9400 Low Power Qseven Computing Platform    IFC-9400 Low Power Qseven Computing Platform
The Inforce IFC-9400 board delivers an extremely cost-effective platform solution for mobile application developers in a true Qseven™ compatible form factor. This compact, high-performance mobile computing platform can be immediately deployed in existing Qseven slots or used as the core processor...
H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T    H6055 - Qseven module with Intel® Atom™ E620T/E640T/E680T
The H6055 is an extremely compact (70 mm x 70 mm) high-performance, ultra-low power COM module based on the Intel® Atom™ E600 series CPUs and the Intel® Platform Controller Hub EG20T. The form factor is Qseven, and H6055 is compliant with...
conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15    conga-QA - QSeven Module, Intel® Atom™ processor Z5xx series and Intel® USW15
Mobile Applications: QSeven is unlike previous Computer-On-Modules (COM) standards due to its primary focus being directed towards mobile and ultra mobile applications. It defines fast serial differential...

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