Microsemi announced a new die packaging technology has passed an internal qualification regime typical for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards. The die packaging technology is targeted at implantable medical devices such as pacemakers and cardiac defibrillators. It can also be used in wearable devices such hearing aids and intelligent patches, as well as nerve stimulators and drug delivery products.
Microsemi’s packaging technology delivers a footprint reduction of approximately 75 percent over the company’s currently available implantable radio modules. Device miniaturization allows physicians to use less invasive procedures, enabling faster recovery times and improvements in patient comfort while concurrently lowering health care costs. Smaller, lighter weight wireless medical devices also afford patients greater mobility.
Microsemi’s ultra low-power ZL70102 transceiver chip supports a very high data rate RF link for medical implantable communication applications. The chip’s unique design allows patient health and device performance data to be quickly transmitted with little impact to the useful battery life of the implanted device. The ZL70102 is designed for use in both implanted medical devices and base stations, and operates in the 402–405 MHz MICS band. Multiple low power wake-up options are supported including using 2.45 GHz ISM band wake-up receive option for ultra low-power operation receiver option.