Infineon Technologies introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. The new 40V OptiMOS T2 power MOSFETs use a diffusion soldering die attach approach to produce the lead-free packages that include TO-220, TO-262 and TO-263. Because of specific requirements in terms of package geometry, die pad thickness and chip size the diffusion soldering die attach approach is today only suitable for these three package types, and Infineon is able to supply them: OptiMOS T2 products in these packages are ready for production.
With the new MOSFET series, Infineon exceeds current RoHS directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100 percent lead-free packaging. As the first MOSFETs in the industry to eliminate lead, the new Infineon devices allow customers to meet these stricter requirements.
The specifications of the new OptiMOS T2 40V, e.g. the IPB160N04S4-02D which provides 160A, offers a R DS(on) of only 2.0mΩ and a R thJC of 0.9K/W. The on-resistance is about 20 percent less compared to related devices using standard lead-based die attach soldering. In addition, the patented diffusion soldering technique results in a reduced ”chip-to-leadframe” thermal resistance and positions the new OptiMOS T2 products with best-in-class performance.
