Samtec is continuing to evolve its line of SEARAY Open Pin Field Interconnects to support the demands of high speed applications requiring highly reliable, high pin count solutions. The latest additions to Samtec’s SEARAY family are a right angle design ideal for perpendicular and high speed micro backplane applications and a press-fit design that combines the flexibility and convenience of press-fit tails with superior signal integrity and mechanical performance. Both designs use a 1,27 x 1,27mm grid array to achieve maximum grounding and routing flexibility, and feature Samtec’s robust, signal integrity-optimized edge rate contact system.
Right Angle SEARAY terminals and sockets are optimized to reduce skew and impedance mismatch and have low insertion and extraction forces. Terminals and sockets are available in 4, 6, 8 or 10-row configurations with up to 500 I/Os. Right angle arrays mate with SEARAY surface mount and right angle sockets and terminals and with SEARAY High Density Flex Data Links and High Speed Twinax cables. Optional guide posts and latching posts are ideal for rugged applications and allow for blind mating press-fit SEARAY terminals are available in 4, 6, 8 or 10-row configurations offering up to 500 I/Os.
The terminals mate with a choice of SEARAY interfaces: surface mount sockets in three standard stack heights, High Density Flex Data Links for cable-to-board applications, or the new right angle sockets for multilayer PCB designs such as high speed micro backplane applications. Additional pin counts, plating options, and guide posts, as well as the required application tooling, are also available.
Samtec has also recently introduced a new 0,8mm micro pitch version of its SEARAY High Density Interconnects offering high speed performance and the unparalleled grounding and routing flexibility of the 1,27mm pitch arrays, while requiring 50% of the board space.
