ADLINK announces it will support the new Computer-on-Module standard from Kontron for ultra low-power embedded architecture platforms with a whole new line of products. Building on our design experience with ARM/RISC in OEM and Intelligent Display projects, this marks ADLINK's first endeavor outside x86 boundaries for a standard form factor product offering.
The new COM standard provides a very slim and low profile solution for ARM/RISC and SOC based ultra low-power processors. The standard specifically targets new fast growing markets such as handheld devices and industrial tablets, and in the near future is also expected to move into more traditional applications such as industrial control and data communications. It will be based on a 314-pin MXM 3.0 connector that allows for a total package height of less than 5 mm for both module and carrier. Two module sizes are specified: a very compact “short” module measuring just 82 mm x 50 mm and a “full size” module measuring 82 mm x 80 mm. The defined pin-out will be able to support both traditional features such as 24-bit RGB, and will be future proof by supporting more modern standards such as LVDS, HDMI and DisplayPort. Power consumption of these ARM/RISC solutions will be on the order of 3W. ADLINK hopes to present early concept models around the end of February 2012, during Embedded World in Nuremberg.
