As AdvancedTCA systems continue to be used as a basis for telecommunications core networks and backbones, demands on their processing power and maximum data throughput rate are constantly increasing. Contributing factors to this include multimedia applications such as on-demand video, mobile internet applications, Web 2.0 and webinars, etc. Accordingly, Schroff has now fitted its current dual star and smaller AdvancedTCA systems with 40 G backplanes. With higher-powered systems, however, not only a higher data rate but also the dissipated heat generated by the multicore processors must be taken into consideration. Schroff has now developed a "next generation" standard AdvancedTCA system with 40 G backplane (4 lanes of 10 Gb/s in parallel) and a cooling capacity of 400 W per slot.
The new 19" AdvancedTCA system is 14 U high and equipped with an AdvancedTCA 40 G backplane with 14 slots and dual-star fabric and dual-star base interface. To dissipate the higher thermal power loss, latest-generation fans are employed. The overall ventilation concept has also been modified. The system now uses a matched push-pull design. A fan module under the board cage features a push system that covers the entire board cage. Above the cage is another fan module containing pull technology. The fan modules are arranged in such a way that if one of them fails, the remaining module can immediately provide the entire cooling capacity. In addition both fan modules feature an IPMB controller addressable by the shelf manager via a bussed or radial IPMB interface.
Owing to the higher power consumption of newer AdvancedTCA boards, the power supply arrangements have also been adapted to the new requirements. For this a new power entry module has been developed that can deliver over 200 A to the system. The system contains two such PEMs to assure redundancy.