GE Intelligent Platforms announces the bCOM2-L1100 rugged COM Express board featuring an Intel Core2 Duo processor operating at up to 2.26GHz and up to 4GBytes of soldered DDR3 SDRAM. A range of processors is available, depending on the performance/watt requirements of the application.
The bCOM2-L1100 provides extensive protection to ensure reliable operation in applications that are subject to shock, vibration and extremes of temperature. All components are soldered to the board for optimum reliability, while mechanical stand-offs provide a high degree of insulation from external forces. Available in a standard version for benign environments, the bCOM2-L1100 is optionally available in extended temperature variants and with conformal coating.
As with all COM Express boards, a carrier board is required for the bCOM2-L1100. The CCAR-L1000 carrier board is available for initial development and testing. GE Intelligent Platforms is also able to provide advice to customers designing their own rugged carrier.
Despite its small size, the bCOM2-L1100 offers a broad range of connectivity and I/O capabilities, including Gigabit Ethernet, eight USB 2.0 ports, four SATA ports, one PATA port, eight GPIO ports, one LVDS port, two SDVO channels, VGA, High Definition Audio and PCI Express. Also provided is a x16 PCI Express port for high-end graphics and video applications. The bCOM2-L1100 provides support for Windows XP, Vista, Windows 7, Linux, and VxWorks.
Wolfgang Patelay, Editor Print & Online 