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SPOTLIGHT

Lastet Issue of Intel's Embedded Innovator

Amongst the highlights of the latest issue of Intel's Embedded Innovator are technical articles about rugged design, touch-screen automation and flexible fan-less modules.

Test automation framework - make or buy?

The main purpose of a test automation framework is to increase product development and product process efficiency. This paper reviews the advantages and disadvantages of making or buying a test automation framework.

Combining Boundary Scan and JTAG Emulation for advanced structural test and diagnostics

Boundary Scan and JTAG Emulation are two perfectly complementary methods, which are fused into one flexible and powerful technique for advanced structural tests by GOEPEL electronic’s VarioTAP technology.

Packaging of rugged commercial-off-the-shelf systems

Rugged COTS systems must be packaged to perform in conditions which may include challenges such as thermal extremes, vibration, shock, electromagnetic (EMI), nuclear/EMP and human source hazards including intrusion and compromise.

AdvancedTCA makes the most of multicore processors

Multicore processors fit nicely into the ATCA infrastructure. The redundant, high-speed ATCA backplane supports both communication and compute-intensive applications.

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 Safety: make software part of the solution

This paper describes three steps that control and process automation developers can take to achieve saftey compliance while cutting costs and complexity.

ARM-based industrial controllers – adaptable to customer specifications

Siemens EDM's (Electronic Design and Manufacturing)  latest platform concept involves industrial controllers that can be adapted to customer specifications.

Don’t crash at the finish line - how to overcome device complexity

Wind River, has developed a new type of device testing solution that provides unprecedented run-time visibility into the operation and quality of complex devices under test. The Wind River Test Management system delivers actionable intelligence that lets teams focus their efforts on what really needs testing.  

Direct hardware access made easy with Secure & Unified Smart Interface 

You are writing an application that requires direct hardware access? Unfortunately, that access is no longer available in modern operating systems. But the SUSI (Secure & Unified Smart Interface) unified interface can help you.  

Embedded News & Know-how Newsletter

(September 1 2010)
Chips, Boards & Tools -- view the latest issue of our e-mail newsletter with Product News and Technical Know-how for Embedded Designers
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August Issue of Boards & Solutions / ECE Magazine

This is a combined issue of Boards & Solutions and ECE Magazine because for the major section – the Yellow Pages European Embedded Companies Directory - it makes a lot of sense to cover the full scope of the embedded market in a single compact reference publication.

Download now the digital version of August 2010 issue

Microchip: 8-bit PIC MCUs feature less than 50 µA/MHz active current

Microchip has unveiled new 8-bit PIC MCUs featuring active currents of less than 50 µA/MHz and sleep currents down to 20 nA. The PIC16F19XX MCUs feature a broad range of peripherals, such as mTouch capacitive touch-sensing module, LCD drive, multiple communications and more Pulse width Modulator peripherals.  All of these general-purpose MCUs are well suited for applications in the appliance; consumer; industrial and automotive markets, among others.

The PIC1XF182X MCUs include dual I2C/SPI interfaces, multiple PWM channels with independent time bases, a Data Signal Modulator, and other peripherals that enable designers to combine many functions into a single MCU.  The PIC16F19XX MCUs provide up to 28 KB of Flash program memory and numerous enhanced capabilities.  The on-chip LCD drive supports up to 184 segments and provides a low-power drive mode for increased efficiency.  The MCUs also include up to 5 Pulse-Width Modulation channels with independent time bases for controlling various motor types and peripherals.

The PIC1XF182X and PIC16F19XX MCUs are available in DFN, PDIP, QFN, SOIC, TQFP, TSSOP and UQFN packages of varying sizes, from 8- to 64-pins.

 


 

WOLFGANG's VIEW - Reports from the European Embedded Market

wp145 Wolfgang Patelay, Editor Print & Online 

 August 16, 2010
If you look at the actual market data you´ll realise that the pork cycle in the electronics industry still exists. According to DMASS (Distributors’ and Manufacturers’ Association of Semiconductor Specialists),  looks 2010 like the all-time record year for European semiconductor distribution – only one year after a recession. EMEA semiconductor distribution grew by a historical 70% in Q2/2010. Record bookings and selective shortages continue.  [read more...] 

August 11, 2010
In a press briefing explained Eroll Dietz, Vice President High-Speed Product Division of National Semiconductor the trends and market drivers for automotive infotainment and driver assistance and the product offering in this area.  [read more...]

August 10, 2010
After the introduction of its energy efficient EFM32 Gecko microcontrollers in 2009 and the announcement of the low-cost EFM32 Tiny Gecko series in 1.Quarter 2010, Energy Micro´s new Vice President Worldwide Sales and Marketing, Andreas Koller, announced details of the EFM32 Giant Gecko product line.  [read more...]

July 7, 2010
 If you watch TV and see accidentally an IBM advert you´ll realise that Big Blue wants to create the world a smarter planet. At a press conference in Munich managers of IBM Rational Software explained how the embedded software tools fit into the business software and therefore in the overall strategy of Big Blue and how this integrated solution will help to build a smarter planet. [read more...]

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